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smt solder paste non-pressure die attach materials Cu Ag silver sintering past

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Shenzhen Jufeng Solder Co., Ltd. Custom manufacturer 15 yrs CN
smt solder paste non-pressure die attach materials Cu Ag silver sintering past
smt solder paste non-pressure die attach materials Cu Ag silver sintering past
smt solder paste non-pressure die attach materials Cu Ag silver sintering past

Key attributes

Industry-specific attributes

warranty
6 months

Other attributes

place of origin
China
customized support
OEM
brand name
Jufeng
Product name
Silver sintering Paste
Material
Ag
Feature
High thermal conductivity
Application
Semiconductor chip packaging
Shelf life
6 Months
Certificate
ISO Rohs
OEM
Acceptable
Packing
Carton
Keywords
silver sinter paste
Viscosity
10Pa.s

Packaging and delivery

Selling Units:
Single item
Single package size:
15X15X6 cm
Single gross weight:
0.005 kg
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Lead time

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Samples

Maximum order quantity: 1 piece
Sample price:
$39.00/piece

Customization

Product descriptions from the supplier

Minimum order quantity: 2 pieces
$199.00

Variations

Total options:
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Shipping

Shipping solutions for the selected quantity are currently unavailable
Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 1 piece
Sample price:
$39.00/piece

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