High-Speed Dual Head Die Bonder: This machine is designed with dual heads, allowing for faster and more efficient die bonding, making it perfect for semiconductor manufacturing operations that require a higher throughput.
Comprehensive Warranty: The product comes with a comprehensive 1-year warranty, ensuring that you can use it worry-free, and the seller will take care of any manufacturing defects that may arise during this period.
Showroom Availability: The product is available for viewing and testing at the seller's showroom located in Russia, India, the United States, and Vietnam, allowing you to inspect the machine's condition and performance before making a purchase.
Robust Core Components: The machine is equipped with PLC (Programmable Logic Controller) as its core component, ensuring its robustness and reliability in semiconductor manufacturing processes.
Marketing Type Hot Product: Recognized as a hot product of 2019, this die bonder die bonding machine has proven to be an effective tool in the semiconductor industry, and it continues to be a popular choice among manufacturers. The seller's expertise and commitment to quality are reflected in this product's success in the market.