Big area deep access wedge gold wire bonder wire bonding machine for Semiconductor Packaging LED IC package

(1 review)

Guangzhou Minder-Hightech Co., Ltd.

Multispecialty supplier 9 yrs

CN

Key attributes

Other attributes

Weight (KG)

700

Showroom Location

Turkey, United States, Viet Nam, Russia

Video outgoing-inspection

Provided

Machinery Test Report

Provided

Marketing Type

Hot Product 2024

Warranty of core components

1 Year

Core Components

PLC

Place of Origin

Guangdong, China

Warranty

1 Year

Condition

New

Brand Name

MINDER-HIGHTECH

Model Number

MDSJSQB-3045

Packaging and delivery

Selling Units:

Single item

Single package size:

150X120X120 cm

Single gross weight:

800.000 kg

Show more

Lead time

Product descriptions from the supplier

>= 1 sets

$100,000.00

Quantity

Shipping

Item subtotal (0 variations 0 items)

$0.00

Shipping total

$0.00

Subtotal

$0.00

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